1. Solder paste to solder paste clearance DRC.
Shown below is the solder paste on two adjacent pins of a 16-TSSOP (0.173", 4.40mm Width) IC.
As shown below the solder paste is 1:1 with the pad and has a 0.05mm (~3mil) soldermask pullback.
Copper to copper feature and paste to paste is 0.2mm (~8mil).
The paste stencil would have a very long a skinny (0.2mm) web separating the solder paste blocks. The stencil could be damaged by the squeegee as the paste is applied.
It would be nice if the tool included a minimum the paste to paste clearance check.
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