"In PCB fabrication process, a copper sliver can cause material to detach during photo-imaging processes in fabrication. Floating pieces can cause defects and shorts which reduce yield. In electric performance aspect, slivers can even contribute to inconsistent impedance if they exist on a plane layer."
Source: High Volume Overseas Contract Manufacturer
My Comments:
Where is the sliver? I only see is a small gap in a copper poured plane or polygon.
To understand this DFM error you have to consider the copper photo-imaging process tolerances.
There are no DFM checks in Altium to identify copper laminate slivers, you need to use fabrication CAM and DFM tools to locate these laminate slivers in your designs.
The minimum gap allowed is 4mils.
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